十層三階HDI板

Release time：2019-08-28 Editor author：Jin Zhi Zhu Read：29093

層數： 10L

板厚： 1.2mm

特殊要求：樹脂塞孔

表面處理：沉金

材料：FR-4 TG170

外層線寬/線距: 2.95/2.95mil

內層線寬/線距: 2.36/2.36mil

最小孔徑：盲孔0.1mm，埋孔0.2mm，通孔0.2mm

銅厚：外層1oz，內層0.5oz & 1oz

十層三階HDI板-1.jpg

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Statement: This article originates from the integration of Jin Zhizhuo's official website, such as copyright issues related to articles and manuscripts. Please contact us in time, and we will deal with them as soon as possible.
Title: Temperature Detection Method for Temperature Control Switches web：http://m.wgvkd.cn/news/12.html

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